Advantages Of Titanium Anode
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Update time : 2023-01-03 21:06:48
The plating uniformity advantage of titanium anode refers to the use of insoluble anode can maintain stable plating uniformity for a long time, which is determined by the characteristics of the insoluble anode itself. In the process of electroplating, in order to ensure the stability of electroplating uniformity, it is necessary to ensure that the plating condition is controllable and stable and the uniformity of discharge from positive to negative extremes should be kept unchanged. The stability of the discharge from the positive extreme to the negative extreme is largely determined by their relative sizes. In the copper plating process of PCB, the soluble phospho-copper ball used will dissolve with the plating process, which leads to the reduction of anode size and the change of relative area. Therefore, the anode discharge uniformity cannot be maintained for a long time by using phosphocopper spheres. The insoluble anode is also known as "size stable anode", which means that the anode size of the insoluble anode remains stable during a long service cycle. At this time, only to ensure that the coating on the surface of the titanium anode does not fail during the anode life and still has discharge and electrocatalytic ability, can ensure the discharge stability from the anode extreme to the cathode end. Generally, after the insoluble anode is installed online, only the first adjustment of the plating uniformity is needed and the stable plating thickness distribution can be obtained for a long time, which can be achieved in the whole anode life cycle "once and for all".
For one thing, titanium anodes can operate at higher current densities. Due to the passivation of phosphide film on the surface of phosphor copper ball, the maximum working current density of phosphor copper ball cannot exceed 2.5~3 ASD. The maximum current density that titanium anode can withstand is dozens of times that of phosphocopper ball (for example, in the field of iron and steel plating, the working current density of titanium anode can reach more than 100 ASD). Therefore, with the support of equipment and matching of plating conditions, titanium anodes are fully capable of achieving higher equipment productivity and production efficiency.
On the other hand, the titanium anode avoids the production interruption caused by the regular addition and maintenance of the phosphocopper ball process. With the use of phosphor copper ball, the consumed phosphor copper ball must be replaced at regular intervals. Before adding the new phosphocopper ball, it needs to be cleaned. After adding, it cannot be produced immediately. It needs a certain time to operate the electrolytic dragging cylinder to make the surface of the phosphating film. After a long time of use, the phosphorus copper ball has been close to the residue state, so it must be thoroughly cleaned out of the titanium basket to avoid plating quality problems. These unavoidable maintenance operations make the copper plating equipment using phospho-copper ball not only unable to run for a long time without interruption, but also cost a lot of manpower. With the titanium anode, the copper oxide powder adding device is independent and the copper oxide powder does not need to be shut down. At the same time, the titanium anode itself is also "maintenance free", that is, during the life cycle of the titanium anode, in principle, there is no need for additional cleaning of the titanium anode. Therefore, the use of titanium anode, in theory, can be completely uninterrupted production, thus saving a lot of maintenance time and manpower input.
The use of titanium anodes allows the composition of the electrobath to be maintained in a more stable state, which is the benefit of the use of copper oxide powder addition:
On the one hand, because the phosphating film thickness on the surface of the phosphating film is difficult to control perfectly, in order to avoid the phosphating film is too thick which leads to the passivation of the phosphating ball, the phosphating ball often appears to be too dissolved, which leads to the continuous rise of the concentration of copper ions in the liquid medicine. Copper ion concentration plays a crucial role in TP value of plating hole, so the fluctuation of copper ion concentration will affect the stability of plating hole effect to a certain extent. At the same time, the chloride ion in the bath will be consumed in the dissolution process of the phosphocopper ball. The fluctuation of chloride ions on the one hand will react to the thickness of phosphating film, on the other hand will also make the effect of plating additives fluctuate. The use of titanium anode will not appear this situation, only need to strictly control the addition of copper oxide powder, you can completely control the concentration of copper ion; At the same time, the chloride concentration itself can be maintained in a very stable state.
On the other hand, the use of phosphor copper ball is more likely to cause the contamination of plating solution, which leads to the early failure of plating additives. The processing of phosphorus copper ball is prepared by the method of smelting and rolling and the copper oxide powder is the copper raw material dissolved in solution and in the solution of further purification and precipitation of copper oxide precursor and finally after calcination of copper oxide powder. Compared with the two processing processes, the processing process of copper oxide powder is more convenient to control the purity of raw materials. Relatively speaking, under the condition of good control, the impurity content of copper oxide powder will be lower than that of phosphorus copper ball. In the process of long-term use, whether it is phosphocopper ball or copper oxide powder, the impurities will dissolve and accumulate in the electroplating solution. Electroplating additives are often very sensitive to the content of impurity ions in the electroplating solution. When the impurity ions in the electroplating solution reach a certain concentration, it will affect the effect of plating additives and thus have a bad impact on the electroplating effect. Therefore, the use of titanium anode plating system, can make the bath to maintain a relatively low pollution state, so that the bath life is more durable, not only reduce the plating solution early failure caused by the extra cost of the bath, in the process of use for the impact of impurities will be more assured.
The capability of plating process depends on two aspects: the design of equipment and the support of plating system.
In terms of equipment design, the use of phosphorus copper ball limited the design of equipment, because the phosphorus copper ball system can not get rid of the "phosphorus copper ball - titanium basket - anode bag" combination mode, this phosphorus copper ball system also determines the electroplating mode must be vertical electroplating. Using titanium anode, can completely get rid of can only be vertical plating mode. Because titanium anodes can be completely customized, the jet flow, circulation, anode distribution, anode styling and other aspects of the equipment can be redesigned and optimized, so that the equipment has a variety of possibilities.
In terms of plating system support, compared with the plating solution pollution caused by the phospho-copper ball system, the titanium anode can provide a higher plating capacity, so the development direction of new plating additives has been basically turned to the adaptation of titanium anode, especially for new applications and higher demand additives development and adaptation. Choosing a titanium anode means choosing the possibility of future development.
